封裝測試是屬於半導體後段的製程，其所需的封裝測試設備也處於供應鏈的後段。除了製造時程短、價格也比前段製程低，這些都使後段製造商面臨設備需求的壓力遠超過前段。封測製造在評估設備需求時，產業技術趨勢、景氣循環以及對於設備需求的時程表等都是主要的考量因素。 本研究透過全球半導體產業狀況與相關分析、五力分析、SWOT、經營策略等相關文獻探討以及個案資料分析與彙整。分析內部環境的優勢與劣勢以及外在環境對半導體封測設備業者的機會與威脅，本研究認為個案公司在面對公司未來的發展，以營運成長作為策略的主軸，透過「與客戶協同開發」和「應用市場擴張」兩項策略達到公司業績持續成長以及擴大整體市佔率並因應市場景氣循環與未來發展適時調整經營策略，以達企業永續經營的目標。;Assembly and Testing is a process that belongs to the back-end of the semiconductor process, and the required Assembly and Testing equipment is also in the back-end of the supply chain. In addition to the short manufacturing time and lower price than the front-end process, all these make the back-end manufactures face the pressure of equipment demand far more than the front-end. When assessing equipment demand, industrial technology trends, business cycles, and schedules for equipment demand are all major considerations. This research uses global semiconductor industry status and related analysis, five forces analysis, SWOT, management strategies and other related literature discussions, and case data analysis and compilation. Analyzing the advantages and disadvantages of the internal environment, opportunities and the threats of the external environment to the semiconductor assembly and testing equipment manufacturer. This study believes that, the case company use operational growth as main orientation of strategy and goals, through two strategies “co-development with customer” and “Apply Market Expansion” to continue the growth of the company’s performance and the expansion of the overall market share and timely adjustment of business strategies in response to market business cycles and future development to achieve the goal of sustainable business operations.
