台灣半導體產業歷經三十餘年發展，晶圓代工實績居全球第一，故若能衡量其組織之營運績效是有其重要性的。本文衡量半導體晶圓代工廠商生產單位之營運績效，係採用台積電國內所擁有晶圓廠90至94年之年度資料，其中包括一座六吋、五座八吋與兩座十二吋晶圓廠。利用資料包絡分析法經由固定規模報酬模式求得整體相對效率值，再透過變動規模報酬模式求得純粹技術效率值及規模效率值，並應用差額變數分析以求得在完全技術效率下最適的投入量，其次再以標竿模式探討台積電以較先進的12吋晶圓廠當作標竿學習廠來評估8吋晶圓廠的營運績效表現，最後則運用時間序列之績效評估，來進一步瞭解各晶圓廠的跨期效率指數與Malmquist生產力指數，並觀察效率是否會因晶圓廠吋別不同而有影響，以提供本身及其他晶圓廠作參考。其研究之結果分析將可提供台積電在晶圓廠的營運效能上作進一步之改進參考，以維持其在競爭激烈的產業環境中高度的競爭力。 本文結果發現，自90到94年這五年來台積電各晶圓廠其整體相對效率大致呈現遞增的趨勢，且其6、8吋晶圓廠可作為12吋晶圓廠的標竿學習廠；至於台積電各晶圓廠在整體相對效率及純粹技術效率上，其在銷貨成本、固定資產以及存貨等投入項目上仍有改善空間。另外，若以台積電較先進的12吋晶圓廠當作標竿學習廠來評估其8吋晶圓廠的營運績效表現，則結果顯示8吋晶圓廠的營運績效表現普遍較12吋晶圓廠來得相對有效率，此意味著台積電在往後12吋晶圓廠的投資上應更為謹慎評估其效益。 ;The present study deals with the operational efficiency of semiconductor foundry manufacturing units. This study is adopted 2001~2005 financial data of Taiwan Semiconductor Manufacturing Company’s (TSMC) fabs in Taiwan, which include two advanced twelve-inch wafer fabs, five eight-inch wafer fabs and one six-inch wafer fab. Basically, I apply Data Envelopment Analysis(DEA) method, by using CCR model to gain aggregate technical efficiency. Furthermore, I procure pure technical and scale efficiency through the use of BCC model. After that, I acquire the most suitable input under aggregate technical efficiency by applying slack variable analysis, and apply variable benchmark model to confer with the operational efficiency by using the advanced twelve-inch wafer fabs to be benchmark fabs to evaluate the eight-inch wafer fabs. Finally, I make use of Malmquist model to review the intertemporal efficiency index and Malmquist productivity index of each fab and observe if the efficiency would be different from various inch fabs. The study results will be an improvement reference of operational efficiency in TSMC fabs and further enable to maintain its highest competitiveness in semiconductor industry. The result of my thesis finds the aggregate technical efficiency trend increased progressively from 2001 to 2005, and six-inch wafer and eight-inch wafer fabs can be as the benchmark fabs of twelve-inch wafer fabs. As for the aggregate technical efficiency and pure technical efficiency in TSMC’s fabs, there are some improvement areas for the input items of cost of good sold, fixed assets and inventories. In addition, if we use the advanced twelve-inch wafer fabs to be benchmark fabs to evaluate the eight-inch wafer fabs, it shows that eight-inch wafer fabs are more efficient than twelve-inch wafer fabs, that means TSMC should be more careful to invest its twelve-inch wafer fabs in the future.
