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    顯示項目651-666 / 666. (共27頁)
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    日期題名作者
    2006 Fabrication of periodic nickel silicide nanodot arrays using nanosphere lithography Cheng SL,Lu SW,Li CH,Chang YC,Huang CK,Chen H
    2006 Local melting induced by electromigration in flip-chip solder joints Tsai CM,Lin YL,Tsai JY,Lai YS,Kao CR
    2006 Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates Tsai JY,Chang CW,Ho CE,Lin YL,Kao CR
    2006 Polymorph farming of Acetaminophen and Sulfathiazole on a chip Lee,Tu; Hung,Shi Ting; Kuo,Chung Shin
    2006 Prevention of electromigration-induced Cu pad dissolution by using a high electromigration-resistance ternary Cu-Ni-Sn layer Hsiao YH,Chuang YC,Liu CY
    2006 Study of electromigration-induced Cu consumption in the flip-chip Sn/Cu solder bumps Liu,C. Y.; Ke,Lin; Chuang,Y. C.; Wang,S. J.
    2006 Study of wetting reaction between eutectic AuSn and Au foil Lai YT,Liu CY
    2006 Thermomigration in eutectic SnPb alloy Chuang YC,Liu CY
    2005 Effect of Ag content and heat treatment on the stress corrosion cracking of Al-4.6Cu-0.3Mg alloy Chang,CH; Lee,SL; Lin,JC; Yeh,MS; Jeng,RR
    2005 Effects of Be and Fe on the mechanical and corrosion behaviors of A357 alloys Yang,CY; Lee,SL; Lee,CK; Lin,JC
    2005 Effects of lead and copper particles on corrosion and wear behaviour of Al-Si matrix composites Chuang,SF; Wu,TF; Lee,SL; Kao,CH; Lin,JC; Lee,ZK
    2005 Electromigration studies of Sn(Cu) and Sn(Ni) alloy stripes Wei,CC; Liu,CY
    2005 High-thermal-stability and low-resistance p-GaN contact for thin-GaN light emitting diodes structure Lin,CL; Wang,SJ; Liu,CY
    2005 In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing Lin,YH; Hu,YC; Tsai,CM; Kao,CR; Tu,KN
    2005 Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations Luo,WC; Ho,CE; Tsai,JY; Lin,YL; Kao,CR
    2005 The effect of silver content on the precipitation of the Al-4.6Cu-0.3Mg alloy Chang,CH; Lee,SL; Lin,JC; Jeng,RR

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